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Authors: Christian Flechsig; Jacob Lohmer; Rainer Lasch; Benjamin Zettler; Germar Schneider; Dietrich Eberts
Journal title: Transactions on Semiconductor Manufacturing
Journal number: 3
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2022
DOI identifier: 10.1109/TSM.2022.3184041
ISSN:0894-6507