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Authors: Sorin Chi?u, Daniel Ciprian Vasile, Ionu? Daniel Tr?mândan, Paul Svasta
Journal title: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Journal publisher: IEEE
Published year: 2020
DOI identifier: 10.1109/siitme50350.2020.9292242
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