EFFRA Innovation Portal

Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

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Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Organisations map overview

ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS (CERTH) - (Coördinator)

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ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK

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APPLIED MATERIALS ITALIA SRL

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ATOMISING SYSTEMS LIMITED

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Artia Nano Engineering and Consulting

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CENTER OF TECHNOLOGY RESEARCH AND INNOVATION LTD

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European Federation for Welding, Joining & Cutting - EWF

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ISQ - Instituo de Soldadura e Qualidade

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MICROSEMI SEMICONDUCTOR LIMITED

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Mat-tech BV

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POLMECANIC Sp. z o.o.

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Prisma Electronics ABEE

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SP SVERIGES TEKNISKA FORSKNINGSINSTITUT AB

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SP SVERIGES TEKNISKA FORSKNINGSINSTITUT AS

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