Predictive discarding of wafers based on power leakage predictions from single layer misalignment data

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Authors: Geert H. van Kollenburg, Mike Holenderski, Patrizia Vasquez, Nirvana Meratnia

Journal title: ISM 2021 - International Conference on Industry 4.0 and Smart Manufacturing

Journal publisher: Procedia Computer Science - Elsevier

Published year: 2022