Integrated electronics for integrated components (Portable sensors unit for environmental monitoring).

Integrated electronics for integrated components (Portable sensors unit for environmental monitoring).
Summary
The overall monitoring system is composed by a large number of portable monitoring units located in strategic areas which need continuous monitoring for safety reasons: powerhouse, wood, volcanoes, storehouse and warehouse (of explosive and inflammable materials). Each monitoring sensors need dedicated monitoring equipment to detect fire, temperature, gases (CO2, O2, N2), electronics for energy managing and data transfer as well as power unit (batteries) and energy harvesting components as PV cell. An example of the network already installed in southern part of Italy, Catanzaro area, is in figure reported. The final demonstrator will be a sensor unit to be included in a sensor network with the final aim to monitor temperature condition as well as fire of specific area. In figure an example of sensor unit is shown. The Laser Structuring process allows the manufacturing of circuit layouts on complex three-dimensional carrier structures. The first integrated electronic components will be antenna for networking data transfer. As a result, weight and fitting space can be effectively reduced. The current design will be readdressed with freeform surfaces aiming new layouts allowed by targeted process. The sensor units will be dislocated within the area in a specific net enable the continuous monitoring of physic-chemical properties (temperature and fire). Controlling the temperature at precise intervals, the sensors units transfer via RF the data to a central unit which elaborates them working out drastic variations. The APPOLO concept allows the use of miniaturized packaged sensor system, PV cells and electronics all connected to each other within the plastic component in order to create a real integrated device. Lasered antenna allows the integration of functionalities within body. Additionally the integration makes easier the assembly, interconnection reducing at the same time manufacturing costs (time to assembly) and saving materials (adhesive, supports, antennas etc.).
Structured mapping
Unfold all
/
Fold all
K TELECOMMUNICATION, COMPUTER PROGRAMMING, CONSULTING, COMPUTING INFRASTRUCTURE AND OTHER INFORMATION SERVICE ACTIVITIES