Periodic Reporting for period 3 - FineSol (Assembly of miniaturized PCBs by using low cost hyper-fine solder powders)

Summary
FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double...
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Web resources: http://www.finesol.org
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Assembly of miniaturized PCBs by using low cost hyper-fine solder powders
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