Periodic Reporting for period 3 - FineSol (Assembly of miniaturized PCBs by using low cost hyper-fine solder powders)

FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double...