Report on MSL demo activities (M42)

The Z-Fact0r strategies will be implemented in the premises of MSL. This task will be linked with the results of the use case design in T1.4. The assembly is a multistage process starting with 1) Visual inspection of the base PCB 2) Glue dot dispense 3) Placement of the die/component 4) Glue cure 5) Wirebond die The glue dot placement process is shown in the figure below and is the most critical problem area. The placement machine (Tresky T-8000) has no optical inspection and no method to automatically correct for the amount of glue being dispensed into the cavity. Consequently visual inspection of the assemblies has to take place and manual adjustment of the amount of glue deposited.