3D Printed Structural Electronics: embedding and connecting electronic components into freeform electronic devices

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: H.Maalderink, F. Bruning, M. de Schipper, J. van der Werff, W. Germs, E. Meinders, R. Mandamparambil Polymer & Moulds Innovations (PMI2016), Ghent (Belgium), 21-23 September 2016

Journal title: Polymer & Moulds Innovations (PMI2016)

Journal publisher: PMI2016

Published year: 2016

Results type(s)
Unfold all
/
Fold all
Report - Video - Presentation - Publication....?
Structured mapping
Unfold all
/
Fold all