Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications

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Authors: Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez

Journal title: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

Journal publisher: IEEE

Published year: 2017

Published pages: 1-7

DOI identifier: 10.23919/EMPC.2017.8346853

ISBN:978-0-9568086-4-6