INTELLIGENT DISASSEMBLY OF COMPENENTS FROM PRINTED CIRCUIT BOARDS TO ENABLE RE-USE AND MORE EFFICIENT RECOVERY OF CRITICAL METALS

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Authors: Bernd Kopacek

Journal title: PLATE 2017 - Product Lifetimes And The Environment

Journal number: November 8-10, 2017

Journal publisher: TU Delft

Published year: 2017

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Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
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