Challenges of reuse and remanufacturing of modern chips in smart mobile devices

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Authors: Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil

Journal title: 2016 Electronics Goes Green 2016+ (EGG)

Journal number: September 7-9, 2016

Journal publisher: IEEE

Published year: 2016

Published pages: 1-7

DOI identifier: 10.1109/EGG.2016.7829846

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Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
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