Modularization of Printed Circuit Boards through embedding technology and the Influence of highly integrated modules on the product carbon footprint of electronic systems

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Authors: T. Kupka, G. Schulz, T. Krivec, AT&S, AT W. Wimmer, Vienna University of Technology, AT

Journal title: Going Green - CARE INNOVATION 2018

Journal publisher: CARE Electronics

Published year: 2018

ISBN:978-3-200-05942-9