Desoldering and remanufacturing of semiconductor components from electronic mobile devices

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Authors: J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL P. Ciszewski, P. Dawidowicz, Semicon, PL G. Podhradsky, Speech Processing Solutions, AT R. Ambrosch, Pro Automation, AT

Journal title: Going Green - CARE INNOVATION 2018

Journal publisher: CARE Electronics

Published year: 2018

ISBN:978-3-200-05942-9

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Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
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