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Authors: Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen
Journal title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Journal publisher: IEEE
Published year: 2019
Published pages: 1-8
DOI identifier: 10.23919/empc44848.2019.8951816
ISBN:978-0-9568086-6-0
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