Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

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Authors: D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann

Journal title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-8

DOI identifier: 10.23919/empc44848.2019.8951790

ISBN:978-0-9568086-6-0

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Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
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