Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann

Journal title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-8

DOI identifier: 10.23919/empc44848.2019.8951790

ISBN:978-0-9568086-6-0

Results type(s)
Unfold all
/
Fold all
Report - Video - Presentation - Publication....?
Report - Video - Presentation - Publication....?
Publication
Structured mapping
Unfold all
/
Fold all
Report - Video - Presentation - Publication....?
Publication
System resource tags
CORDA
Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
Search
Search on Google
Search on Bing
Search on DuckDuckGo
Contacts
Not specified (see website if available) or see associated project
Associated projects
Associated products/services
  • No items published
Organisations
  • Not specified
Powered by Chris Decubber BV