Summary
ESS (End-User), MEMS sensors producer, will use modeling and simulation tools by Helic (ISV) to investigate for possible detrimental self- and mutual- inductance effects on their sensor front-end designs, option previously not available due to high cost of modeling software. EDA Software Provider, HELIC, will make available, online and on-demand, their modeling tools to ESS, in-line with Helic plans to eventually establish SaaS as an alternative business model for SME end users. Research institute ATHENA will optimize HELICs software for grid usage.
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