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Authors: G. Hantos, J. Hegedus, M. C. Bein, L. Gaal, G. Farkas, Z. Sarkany, S. Ress, A. Poppe, M. Rencz
Journal title: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Journal publisher: IEEE
Published year: 2017
Published pages: 1-7
DOI identifier: 10.1109/EPTC.2017.8277493
ISBN:978-1-5386-3042-6
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