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Authors: Robin Bornoff, Gabor Farkas, Lajos Gaal, Marta Rencz, Andras Poppe
Journal title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2018
Published pages: 1-7
DOI identifier: 10.1109/EuroSimE.2018.8369929
ISBN:978-1-5386-2359-6
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