Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

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Authors: A. Alexeev, G. Martin, G. Onushkin

Journal title: Microelectronics Reliability

Journal number: 87

Journal publisher: Elsevier BV

Published year: 2018

Published pages: 89-96

DOI identifier: 10.1016/j.microrel.2018.05.014

ISSN:0026-2714