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Authors: Marton Nemeth, Andras Poppe
Journal title: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2017
Published pages: 1-6
DOI identifier: 10.1109/DTIP.2017.7984460
ISBN:978-1-5386-2952-9
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