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Authors: Willem D. Van Driel, J.W. Bikker, M. Tijink
Journal title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2020
Published pages: 1-5
DOI identifier: 10.1109/eurosime48426.2020.9152686
ISBN:978-1-7281-6049-8
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