| Contact: | Contact this portal member |
- components for chip production and packaging machinery
Comment : various application areas (e.g. logic IC, advanced materials like SiC, GaN in power electronics, quantum and Graphen/2D materials based chips); new manufacturing and surface engineeringt echnologies and are required for machinerycomponents e.g. for high resolution lithography, 3D integration processses, nanostructuring; objectives are improvement of sustainability, autonomy in raw materials, production cost efficiency and upskilling of jobs
- Photonic components and devices
- high efficiency power electronics (inverters, switches etc. for energy conversion)
- digital transformation: devices for computing, data and communication (6G)
- components for chip production and packaging machinery
Comment : various application areas (e.g. logic IC, advanced materials like SiC, GaN in power electronics, quantum and Graphen/2D materials based chips); new manufacturing and surface engineeringt echnologies and are required for machinerycomponents e.g. for high resolution lithography, 3D integration processses, nanostructuring; objectives are improvement of sustainability, autonomy in raw materials, production cost efficiency and upskilling of jobs
Comment : various application areas (e.g. logic IC, advanced materials like SiC, GaN in power electronics, quantum and Graphen/2D materials based chips); new manufacturing and surface engineeringt echnologies and are required for machinerycomponents e.g. for high resolution lithography, 3D integration processses, nanostructuring; objectives are improvement of sustainability, autonomy in raw materials, production cost efficiency and upskilling of jobs