Summary
This paper propose a solution for wafer defect analysis based on macroscopic image captures. The main attention is a simplified camera set-up effort. In this way, algorithms have to compensate the disturbing effects. Therefore, this effects need not to be consider to the setting up of camera. In this context, algorithms are presented for circle recognition, pattern segmentation and classifying, which deals with posed Problem.
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Country: | DE |
Address: | Mittweida |
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