Joining processes on advanced 3D MID system carriers

Joining processes on advanced 3D MID system carriers
Summary
The new technology with fine pitch metal lines on MID substrates enables the assembly of smaller components like fine pitch bare dies and the high accuracy assembly of micromechanical and micro optical devices. Several processes have been developed at Hahn-Schickard.
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C MANUFACTURING
C26 Manufacture of computer, electronic and optical products
C27 Manufacture of electrical equipment
C28 Manufacture of machinery and equipment n.e.c.
C29 Manufacture of motor vehicles, trailers and semi-trailers
Joining processes on advanced 3D MID system carriers
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Anke Ihle-Benz

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