Fill-Level Sensors

Deployment of solutions for monitoring the fill level of bins with recyclable material trigger handling of the material and the involvement of the recycling companies. The sensors trigger the online bidding process in the Virtual Marketplace.

Features include:

• Easy installation with a LoRa Gateway.
• Durable case installed in industrial bins.
• Error checking for false measurements and overload notification capabilities
• Provision of data to Simulation and Prediction tools.
• Use of ultrasonic sensor modules.
• Battery powered with ultra-low power design

To see where the individual component belongs in the COMPOSITION Solutions, see the associated resource D2.4 The COMPOSITION Architecture Specification II.