D5.10 Intrafactory interoperability layer II

A public software deliverable, led by ISMB, featuring the Intrafactory interoperability layer; this updates D5.9

The present document named “D5.10 Intrafactory interoperability layer II” is a public deliverable of the COMPOSITION project, co-funded by the European Union’s Horizon 2020 Framework Programme for Research and Innovation under Grant Agreement No 723145. It reports the final results of task “5.5–Adaptation Layer for Intrafactory interoperability” that foresees its development in work package 5 “Key Enabling Technologies for Intra-and Interfactory Interoperability and Data”.

The document owner is ISMB and this final version is a reiteration of the submitted at M18, namely D5.9Intrafactory interoperability layer I. This version highlights the final results after a second iteration oftask5.5, regarding the development of Intrafactory Interoperability Layer. This communication layer is one of the key components in the COMPOSITION ecosystem, for granting a reliable communication layer across the intrafactory scenarios. It is therefore involved in all intrafactory use cases which will be deployed in all intrafactory pilots at end users’ premises.

Key topic addressed is the intrafactory interoperability among components. Starting with the architecture of the interoperability layer and how it was created using RAMI4.0 architectural model as a reference point. It then describes how the scalability, extensibility, interoperability and integrated security are obtained, detailing, in 4 sections, how these qualities have been achieved.

The Building Management System (BMS) describes how the extensibility and the interoperability is obtained through the use of the Hardware Abstraction Layer and the Storage Handler. The interoperability is obtained by the component called Link Smart which affects also the scalability thanks to its modularity. Finally, the integrated security is deeply explained in the last section. Even though the main qualities can be partitioned in the 4 main components, the truth is that each component contributes almost equally to each of the aforementioned qualities.

The resulting architecture is focused on providing all the necessary elements to enhance the responsiveness of COMPOSITION IoT devices, services and people by creating a dynamic and flexible shop floor communication environment able to balance usability and security. In particular, security has been a major concern for such system that ensures authentication, authorization and message integrity exploiting the services provided by the COMPOSITION Security Framework.

Furthermore, the Intrafactory Interoperability Layer acts as a self-consistent link among all the heterogeneous physical sensors systems in the factory and the software modules in the upper layers(data processing, decision support, etc.)reducing the duplication of functions and services across them and ensuring the conformity among interconnected components communications.

It is worth mentioning that, in spite of being considered a component by the COMPOSITION’s architecture, the Intrafactory Interoperability Layer is a conglomerate of heterogeneous sub-components that act together for the same scope within a common intrafactory scenario and form the core of the IIMS. During the lifetime of the component in light of existing used technologies as: Keycloak, RabbitMQ and LinkSmart® the TRL has been raised to from 6 to 7. It is worth specifying that in the cases of RabbitMQ and LinkSmart® the components have been furthermore developed with the addition of several modules. (Please refer to section 5and section 7.1.1)The biggest asset of this component is the ability to provide a complete Industry solution which goes from the hardware level with the Building Management System (section 6) all the way up to the data analytics using LinkSmart®(section 5) ensuring the security of each sub component as defined in section 7.