A Novel Multi-Scale Method for Thermo-Mechanical Simulation of Power Integrated Circuit

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Authors: A. Bojita, M. Purcar, D. Simon, C. Florea, C. Boianceanu and V. Topa

Journal title: IEEE Journal of the Electron Devices Society

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2022

DOI identifier: 10.1109/jeds.2022.3144530

ISSN: 2168-6734