Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process

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Authors: Sarthak Acharya, Shailesh Singh Chouhan, Jerker Delsing

Journal title: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

Journal publisher: IEEE

Published year: 2019

Published pages: 206-209

DOI identifier: 10.23919/nordpac.2019.8760349

ISBN:978-91-519-2090-0

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