New improved metal plating processes for ultrafine pitch LDS MID

Laser Direct Structuring enables fine metal lines on 3D injection molded thermoplastic substrates. With the new developed laser structuring system metal line pitches up to 70 micrometer on 2D substrates and below 150 micrometer on 3D substrates can be realized. After laser structuring a cleaning process is carried out. This can be a wet chemical cleaning process with ultrasonic support. Best results for ultra fine pitch metal lines are achieved using CO2 snow jet cleaning. The metallization process starts with the selective deposition of electroless copper. For ultrafine pitch metal lines the lateral growth of the metal layer restricts the metal line pitch. Therefore the electroless nickel/gold surface finish is limited applicable for ultra fine pitch LDS MID. Hence in the project the new layer systems using palladium/gold or silver as surface finish have been developed.