Chip and Board Scale Transient Thermal Simulations for Power MOS Devices Reliability Analysis

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Authors: Madalin Vasile Moise, Paul Svasta, Norocel Codreanu, Ciprian Ionescu, Mihaela Pantazica, Alexandru Vasile, Bogdan Mihailescu, Cristian Boianceanu

Journal title: 2021 44th International Spring Seminar on Electronics Technology (ISSE)

Journal publisher: IEEE

Published year: 2021

Published pages: 1-4

DOI identifier: 10.1109/isse51996.2021.9467624

ISBN:978-1-6654-1477-7

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