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Results:LDS is used to create conductive paths on plastic components, e.g. mobile phone casings. The new capabilities of ultra-fine pitch LDS enable the manufacture of sensor packages, interposers and other high complexity electronics.
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Results:LPKF has planned and set up the prototype machine capable of creating conductive structures with line/pitch of 25/25 µm. It is now located at the HSG-IMAT for demonstration and further process developement. LPKF plans to further improve the machine and adopt it into their product portfolio.