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HOLISTEP | SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION 01-01-2024 - 31-12-2027 Show more information MiE SRIA R&I Priorities Specific Objective 1: Excellent, responsive and smart factories & supply chains R&I Objective 1.5: Advanced Manufacturing processes for smart and complex products HORIZON-CL4-2023-TWIN-TRANSITION-01-02: High-precision OR complex product manufacturing – potentially including the use of photonics R&I Objective 1.3: Zero-defect and zero-downtime high-precision manufacturing, including predictive quality and non-destructive inspection methods HORIZON-CL4-2023-TWIN-TRANSITION-01-02: High-precision OR complex product manufacturing – potentially including the use of photonics R&I Objective 1.6: Manufacturing for miniaturisation and functional Integration HORIZON-CL4-2023-TWIN-TRANSITION-01-02: High-precision OR complex product manufacturing – potentially including the use of photonics
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