EFFRA Innovation Portal

1D ResNet for Fault Detection and Classification on Sensor Data in Semiconductor Manufacturing

Project: MADEin4

Updated at: 29-04-2024

Ensemble Machine Learning Algorithms for Anomaly Detection in Multivariate Time-Series

Project: MADEin4

Updated at: 29-04-2024

Uncertainties in the reconstruction of nanostructures in {EUV} scatterometry and grazing incidence small-angle X-ray sca...

Project: MADEin4

Updated at: 29-04-2024

Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application

Project: MADEin4

Updated at: 29-04-2024

Modelling Ion Production inside an Electron Impact Ionizer for High-Vacuum Gas Analysis

Project: MADEin4

Updated at: 29-04-2024

D6.3.3: SEMI Technology Unites Global Summit Dissemination Factsheets

Project: MADEin4

Updated at: 29-04-2024

Projection methods for high numerical aperture phase retrieval

Project: MADEin4

Updated at: 29-04-2024

A fusion of electronic design, process and metrology in semiconductor manufacturing for improved process optimization an...

Project: MADEin4

Updated at: 29-04-2024

Surface Topography of Si/TiO2 Stacked Layers on Silicon Substrate Deposited by KrF Excimer Laser Ablation

Project: MADEin4

Updated at: 29-04-2024

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Project: MADEin4

Updated at: 29-04-2024

SYSTEM AND METHOD FOR INSPECTION AND METROLOGY OF FOUR SIDES OF SEMICONDUCTOR DEVICES

Project: MADEin4

Updated at: 29-04-2024

D6.3.5: ENBIS 2021 data management / machine learning Workshop Dissemination Factsheet

Project: MADEin4

Updated at: 29-04-2024

Predictive discarding of wafers based on power leakage predictions from single layer misalignment data

Project: MADEin4

Updated at: 29-04-2024

Penalised robust estimators for sparse and high-dimensional linear models

Project: MADEin4

Updated at: 29-04-2024

PROLIFIC: A Fast and Robust Profile-Likelihood-Based Muscle Onset Detection in Electromyogram Using Discrete Fibonacci S...

Project: MADEin4

Updated at: 29-04-2024

Penalized wavelet estimation and robust denoising for irregular spaced data

Project: MADEin4

Updated at: 29-04-2024

Flexible, boundary adapted, nonparametric methods for the estimation of univariate piecewise-smooth functions

Project: MADEin4

Updated at: 29-04-2024

Increase of wafer inspection tool throughput with computational imaging

Project: MADEin4

Updated at: 29-04-2024

Phase retrieval from overexposed PSF: a projection-based approach

Project: MADEin4

Updated at: 29-04-2024

MFIG - a Mass Filtered Ion Gauge

Project: MADEin4

Updated at: 29-04-2024

High-NA EUV photoresist metrology using high-throughput scanning probe microscopy

Project: MADEin4

Updated at: 29-04-2024

Wavelet-based robust estimation and variable selection in nonparametric additive models

Project: MADEin4

Updated at: 29-04-2024

Virtual Metrology to Eliminate Test Wafers Measurements on Copper Electroplating Deposition

Project: MADEin4

Updated at: 29-04-2024

Similarity-based Brownian Motion Approach for Remaining Useful Life Prediction

Project: MADEin4

Updated at: 29-04-2024

Pulsed Laser Deposition of SWCNTs on Carbon Fibres: Effect of Deposition Temperature

Project: MADEin4

Updated at: 29-04-2024

Analysis of Line-Edge Roughness Using EUV Scatterometry

Project: MADEin4

Updated at: 29-04-2024

High-Speed Tapping Mode AFM Utilizing Recovery of Tip-Sample Interaction

Project: MADEin4

Updated at: 29-04-2024

Prediction of Yield in semiconductor production from defects optically detected on the Wafers

Project: MADEin4

Updated at: 29-04-2024

Data fusion by artificial neural network for hybrid metrology development

Project: MADEin4

Updated at: 29-04-2024

Multi-branch neural network for hybrid metrology improvement

Project: MADEin4

Updated at: 29-04-2024

Resources

Selected filters:

1D ResNet for Fault Detection and Classification on Sensor Data in Semiconductor Manufacturing

Ensemble Machine Learning Algorithms for Anomaly Detection in Multivariate Time-Series

Uncertainties in the reconstruction of nanostructures in {EUV} scatterometry and grazing incidence small-angle X-ray sca...

Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application

Modelling Ion Production inside an Electron Impact Ionizer for High-Vacuum Gas Analysis

D6.3.3: SEMI Technology Unites Global Summit Dissemination Factsheets

Projection methods for high numerical aperture phase retrieval

A fusion of electronic design, process and metrology in semiconductor manufacturing for improved process optimization an...

Surface Topography of Si/TiO2 Stacked Layers on Silicon Substrate Deposited by KrF Excimer Laser Ablation

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

SYSTEM AND METHOD FOR INSPECTION AND METROLOGY OF FOUR SIDES OF SEMICONDUCTOR DEVICES

D6.3.5: ENBIS 2021 data management / machine learning Workshop Dissemination Factsheet

Predictive discarding of wafers based on power leakage predictions from single layer misalignment data

Penalised robust estimators for sparse and high-dimensional linear models

PROLIFIC: A Fast and Robust Profile-Likelihood-Based Muscle Onset Detection in Electromyogram Using Discrete Fibonacci S...

Penalized wavelet estimation and robust denoising for irregular spaced data

Flexible, boundary adapted, nonparametric methods for the estimation of univariate piecewise-smooth functions

Increase of wafer inspection tool throughput with computational imaging

Phase retrieval from overexposed PSF: a projection-based approach

MFIG - a Mass Filtered Ion Gauge

High-NA EUV photoresist metrology using high-throughput scanning probe microscopy

Wavelet-based robust estimation and variable selection in nonparametric additive models

Virtual Metrology to Eliminate Test Wafers Measurements on Copper Electroplating Deposition

Similarity-based Brownian Motion Approach for Remaining Useful Life Prediction

Pulsed Laser Deposition of SWCNTs on Carbon Fibres: Effect of Deposition Temperature

Analysis of Line-Edge Roughness Using EUV Scatterometry

High-Speed Tapping Mode AFM Utilizing Recovery of Tip-Sample Interaction

Prediction of Yield in semiconductor production from defects optically detected on the Wafers

Data fusion by artificial neural network for hybrid metrology development

Multi-branch neural network for hybrid metrology improvement